Banks Eye $21 Billion Bonds for Broadcom Chip-Financing Deal

Banks Eye $21 Billion Bonds for Broadcom Chip-Financing Deal

Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package that Broadcom Inc. has pulled together to help finance chips for AI developer Anthropic PBC.

Banks are planning to sell as much as about $21 billion of high-grade bonds as soon as early next year as part of a $63 billion funding package that Broadcom Inc. has pulled together to help finance chips for AI developer Anthropic PBC.
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Bloomberg — Markets (EN)




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